Estudio de adhesivos para la construcción naval mediante análisis térmico y reológico

  1. Sánchez Silva, Bárbara
unter der Leitung von:
  1. Ramón Artiaga Co-Doktorvater/Doktormutter
  2. Jorge López Beceiro Co-Doktorvater/Doktormutter

Universität der Verteidigung: Universidade da Coruña

Fecha de defensa: 15 von Oktober von 2021

Gericht:
  1. José María Franco Gómez Präsident/in
  2. Ana Álvarez García Sekretär/in
  3. Francisco Antonio Corpas Iglesias Vocal

Art: Dissertation

Teseo: 687314 DIALNET lock_openRUC editor

Zusammenfassung

The use of adhesives in the shipbuilding sector is still quite limited because it is necessary in many cases to study all the parameters that may be conditioned by the type of application in order to be able to demonstrate the safety of their use to classification societies. But beyond the approval by the classification societies, it is of great interest in shipbuilding and ship certification to know how adhesive joints will behave under different conditions. The properties of adhesive joints depend, apart from the joint design, on the adhesive used, so a complete mechanical and thermal characterisation of the adhesive should be an initial step in any study of adhesive joints. However, because there are several types of adhesives with very different curing characteristics and behaviours, there is currently no single valid method to characterise any type of adhesive. Therefore, in this work, in order to analyse the thermal, rheological and mechanical properties of three different adhesives, thermogravimetric analysis techniques (TGA), differential scanning calorimetry (DSC) and rheological tests have been jointly applied to determine not only the thermal stability, the glass transition temperature (Tg) and the modulus of the adhesive itself, but also to determine the behaviour of these adhesives in metal-to-metal joints by means of mechanical shear and tensile tests. The aim is to show a methodology for the characterisation of adhesives that facilitates the choice of adhesive according to its application